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Flux JYD Soldering Paste 50/10G
Product Overview
The Flux JYD Soldering Paste from Pro Tronix is a specialized formula developed for the high-precision demands of modern electronics. While often available in larger tins, this 10g syringe version is favored by professionals for mobile phone repairs, laptop motherboard rework, and delicate DIY projects where controlled application is critical.
The paste acts as a powerful wetting agent that cleans surfaces during the soldering process, significantly reducing the surface tension of molten solder. This allows for smooth, shiny joints and prevents common issues like solder bridging or “dry” joints. Its no-clean formulation means that any remaining residue is non-conductive and non-corrosive, though it can be easily removed with isopropanol if a pristine aesthetic is required.
Technical Specifications
| Feature | Specification |
| Microcontroller / Type | No-Clean Flux Paste |
| Model | ZJ-18 / JYD Series |
| Weight | 10 grams |
| Form | Semi-Solid Gel/Paste |
| pH Level | Neutral (7 ± 0.3) |
| Melting Point | Approx. 130°C – 150°C |
| Conductivity | Non-conductive Residue |
| Compatibility | Lead-Free & Sn-Pb Alloys |
| Supplier | Pro Tronix |
Key Features
Precision Dispensing: The syringe format allows you to apply the exact amount of flux needed directly onto pads or pins, minimizing waste and mess.
Superior Wetting: Dramatically improves the flow of solder, making it easier to work with lead-free alloys which typically have higher melting points.
Neutral & Non-Corrosive: With a pH of approximately 7, it will not damage sensitive copper traces or component leads over time.
Excellent Insulation: High dielectric strength ensures that residue does not cause parasitic capacitance or short circuits on high-frequency boards.
Oxidation Removal: Chemically removes oxide layers from pads and solder balls, essential for successful BGA reballing and SMD soldering.
Common Applications
Mobile & Laptop Repair: Ideal for soldering small ICs, charging ports, and BGA chips.
SMT/SMD Assembly: Perfect for hand-soldering surface-mount components like 0603 resistors or SOIC chips.
BGA Reballing: Provides the necessary tackiness to hold solder balls in place during reflow.
Fine-Pitch Soldering: Helps prevent bridges between pins on high-density connectors and microcontrollers.
💡 Pro Tip: To extend the shelf life of your flux and prevent it from drying out, always recap the syringe immediately after use and store it in a cool, dark place (ideally between 5°C and 25°C).
You can see our full range of soldering aids and consumables from here: Soldering Tools | Pro Tronix
